Si (silicon) wafer polishing process
Polishing processes are available in various sizes and thicknesses.
Regarding SOI wafers, the transition to larger diameters (12"φ) is steadily progressing, and currently, the latest technologies that cannot be achieved with smaller diameters are being developed with these materials. However, the subsequent processes (device processes) are limited to smaller diameters (8"φ or less), which means that the latest technologies available in large-diameter materials cannot be utilized. Japan Exceed is constantly striving to improve technology to meet these needs and has established a production system based on mass production. Additionally, size reduction of SOI wafers is also possible. 【Processing Details】 ■ Material Names: Various diameter Si wafers, SOI wafers, single crystal and polycrystalline silicon component materials (electrodes for dry etching equipment, focus rings, etc.) ■ Compatible Sizes - Φ12.5mm to Φ200mm - 3mm×3mm to 156mm×156mm - Rectangular shapes are also supported - Finished Thickness: 25μm and above - Flatness: TTV 1μm or less - Particles: 20 or fewer at 0.2μm - Surface Roughness: 0.3nm or less - Film Thickness Control: Possible *For more details, please download the materials or contact us.
- Company：日本エクシード
- Price：Other
